Global In-Mold Electronics Leaders Converge for IMSE Days 2.0

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TactoTek conference features experts in design, materials, production and testing in automotive, industrial, smart home and consumer markets.
OULU, FINLAND (15 May 2019) – TactoTek, the global leader in injection molded structural electronics (IMSE™) technology, with support from Platinum sponsor MacDermid Performance Solutions, Silver sponsors, Altium and Niebling, and presenters from across the in-mold electronics ecosystem will convene the IMSE Days 2.0 conference on June 5, 2019 in Oulu, Finland. Printed electronics are at the core of IMSE solutions, and Oulu is the center of a region

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